Microelectronics Packaging at APL: Delivering Custom Devices for Critical Missions

Abstract

At the Johns Hopkins University Applied Physics Laboratory (APL), microelectronics packaging includes a wide range of microelectronics fabrication and assembly technologies. Conventional microelectronics packaging integrates electronics on a bare die level. At APL, microelectronics packaging has evolved to include packaging of customized miniature electrical, mechanical, and electromechanical devices. APL’s engineers design, fabricate, assemble, inspect, screen, repair, and provide depackaging solutions for diverse projects and sponsors. Because of its technological capabilities and facilities, along with the skill sets of its staff members, APL is able to prototype and produce a broad range of devices, such as sensors, detectors, and communications and computing hardware, for mission-critical projects supporting research and development, defense, near-Earth and deep-space missions, and medicine. This article highlights microelectronics packaging capabilities at APL.